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UV laser cutting machine is used for precise cutting of flexible circuit boards and organic cover films without the need for molds or protection board fixation. By using a high-energy laser source and accurately controlling the laser beam, the processing speed can be effectively increased and accurate processing results can be obtained.

1. Control software with independent intellectual property rights, humanized interface, complete functions, and simple operation;
2. Any graphics can be processed, different thicknesses and different materials can be cut, layered processing can be performed and completed simultaneously; optimized optical system design to ensure high beam quality, reduce the focus spot size, and ensure processing accuracy;
3. It adopts high-performance ultraviolet laser with short wavelength, high beam quality and high peak power. Because the ultraviolet light realizes the processing of the material through decomposition and vaporization rather than melting, there is almost no burr, little thermal effect, no delamination after processing, the cutting effect is precise, smooth, and the side wall is steep.
4. The sample is fixed by vacuuming, without the need for mold protection plate to fix, which is convenient and quick and improves the processing efficiency.
5. It can cut various substrate materials, such as silicon wafers, ceramics, glass, etc.
6. Automatic correction, automatic positioning function, multi-plate cutting function, automatic measurement of plate thickness and compensation function, motor full travel and compensation function, better processing uniformity, less processing depth fluctuation, and higher processing efficiency of complex graphics.

It is applied in many fields in the production of 3C industry, including FPC profile cutting, contour cutting, drilling, cover film opening window, soft and hard board uncovering and trimming, mobile phone case cutting, polymer material cutting, mobile phone camera division Plate, brittle material cutting, PCB shape cutting, etc.